Solder Paste (TDS)

TECHNICAL DATA:-

CATEGORY RESULTS PROCEDURES
POWDER PROPERTIES
Alloys SP63/37 J SP63/37 J-STD-006
Density 8.4g/cm3
Melting Point 183`C DSC
Powder Size T40:20-38μm IPC-TM-650 2.2.14
CHEMICAL PROPERTIES
Activity Level ROM1 IPC J-STD-004A-2004
Acid value 147mg KOH/g GB/T 9491-2002
Copper Corrosion Test PASS JIS Z 3284
Copper Mirror Test PASS JIS Z 3197
SOLDER PASTE PROPERTIES
State Smooth Visual
Metal Content 90%±0.5% IPC-TM-650 2.2.20
Viscosity 180±20 pa·s JIS Z 3284
Solder ball 0 IPC-TM-650 2.4.43
Slump Resistance Cold slump IPC-TM-650 2.4.35
Stencil thickness is 0.2mm Hot slump
Spread >89% JIS Z 3197 8.3.1.1
Tackiness 55-80 grams JIS Z 3284
SIR

(40℃ 90-95%RH 168h)

>5×1010; PASS JIS Z 3284
Electronic Migration Test

(DC50V 40℃ 90-95%RH,1000h)

PASS JIS Z 3284

SOLDERING:-

Solder Paste [63/37] is formulated for wide reflow profile window for different technology process. To achieve better wetting and to form a qualified solder joint, the acceptable temperature range above the melting point of the solder alloy is 30~45 ℃. For BGA process, the time should be prolonged to 150`C-180`C to reduce voids.

The following profile is recommended of Solder Paste 63/37 , while the actual profile can be adjusted based on the process and others.

Note:-  Refer to component and board supplier data for thermal properties at elevated temperatures.

CLEANING:-

The residue of Solder Paste 63/37  is transparent and insulated to be kept on board.

Once needed, it can be easily cleaned off by cleansers.

STORAGE AND USING:-

Solder Paste [63/37] should be stored in a refrigerator at  2 to 10°C. Shelf life of refrigerated paste is six months. It should be permitted to reach room temperature for up to 4 hours before unsealing its package prior to use. This will prevent moisture condensation building up in the solder paste.

It can be stored at room temperature for 3months.

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Product Description

Solder Paste [63/37 ] is no-clean solder paste designed for precision assemble of SMT. .It is engineered to deliver excellent slump resistance and printability for fine geometries with low voiding, especially in BGA. It is formulated for wide reflow profile window with good soldering performance, applied in mobile phones, military industry, automotive electronics and other fields.

FEATURES & ADVANTAGES:-

  • The special formula of flux has a great impact on minimizing the occurrence of head-in-pillow defects of BGA, and makes low voiding.
  • Its excellent print capability can across fine pitch feature repeatability for 24h.
  • Good wetting performance for different substrates.
  • Halide-free material meets the environmental protection requirements.
  • Residue is transparent, reliable and not corrosive.

APPLICATION:-

Solder Paste [63/37] is formulated for both standard and fine pitch stencil printing, at print speed between 25mm/sec to 100mm/sec, with stencil thickness from 0.080mm to 0.150mm.

PRODUCT INFORMATION:-

  • AlloysSP63/37
  • Powder SizeT40
  • Residues4% (w/w)
  • Packaging Sizes: 500 gram jars

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